Blar i SINTEF Open på forfatter "Dalsjø, Per G."

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    • TSV development for miniaturized MEMS acceleration switch 

      Lietaer, Nicolas; Summanwar, Anand; Bakke, Thor; Taklo, Maaike Margrete Visser; Dalsjø, Per G. (Chapter, 2011)
      Fragile micromachined MEMS structures are usually protected by bonding a capping wafer to the device wafer itself. As opposed to using lateral interconnects at the interface between the cap wafer and the device wafer, the ...

    • TSV development for miniaturized MEMS acceleration switch 

      Lietaer, Nicolas; Summanwar, Anand; Dalsjø, Per G.; Bakke, Thor; Tofteberg, Hannah Rosquist (Lecture, 2010)
      Fragile micromachined MEMS structures are usually protected by bonding a capping wafer to the device wafer itself. As opposed to using lateral interconnects at the interface between the cap wafer and the device wafer, the ...

    • Wafer-level packaged MEMS switch with TSV 

      Lietaer, Nicolas; Bakke, Thor; Summanwar, Anand; Dalsjø, Per G.; Gakkestad, Jakob; Niklaus, Frank (Lecture, 2011)